Please contact your local distributor for pricing at: www.lpkf.com/en/contact

a kidney

Hi Souhaib, Thank you for your question. The ProtoLaser S4 removes copper with the LPKF patented hatch & delamination process for direct structing and can process a 160mm x 100mm double sided design in approximately 45 minutes; over 1sq.in/min on laminated 1/2oz FR4. The ProtoLaser S4 also drilled 304 holes of varying size in only 7 minutes on 1mm thick FR4 and can process similar materials and RF/MW substrates. The Contac S4 periodic reverse pulse plating system requires 120 minutes including two pre-cleaning baths, carbon activation and the plating bath; 18um copper is plated in all through-holes. Please feel free to email me directly with additional questions or if a copy of the application report/presentation would be helpful. Best regards, Rory Grondin LPKF Laser & Electronics Rapid Prototyping Systems Sales Manager - North America [email protected]

Sure, V-scored panels cut by laser will induce far less mechanical stress to the panel, allowing for for precise cuts, with components mounted right to the edge of the board without breaking solder joints.

The ProtoLaser U4 has a 6W UV laser source which is ideal for the hatch and delaminate process used in PCB prototyping. LPKF also offers several other higher power UV, IR and green wavelengths in both nano and picosecond lasers.

Yes, it certainly does work, however the purpose of this particular video was to highlight the small size of this milling machine which is helpful for mobile labs and field service techs. LPKF has been making milling machines for PCB prototyping since the mid 1970s, and while there are several other demo videos which focus on the drilling/milling/routing procedures, this particular video was meant to highlight mobility rather than basic operation. We certainly don't recommend it as a body building tool though . . . because, as you can see, it is far too light and mobile for that! ; )

If you have cost inquiries, or want a custom ROI for your application please contact our reps at [email protected] or 1-800-345-5753.

Hello, yes you have! If your company would like any more information on any of our laser plastic welding products then please contact our sales team at [email protected] or 1-800-345-5753.

Hi Ivan! If you'd like pricing then please email [email protected] or call 1-800-345-5753. Thank you.

Hello, Chugawar, this laser uses 6W. If you'd like additional information about this laser feel free to email them at [email protected].

@@LPKFUSAinc thanks!

@@chugawar You're welcome!

Hello Rodrigo, here is our sales engineer's email so that you can get more information on pricing: [email protected]. Her name is Mirela.

Hello Hong, Yes, the LPKF UV laser systems are able to drill, cut and depth engrave a wide range of PCB materials at 1.3mm thickness or less. At ~6 watt for the ProtoLaser U3 or new ProtoLaser U4, 0.8mm thickness or less is recommended due to faster processing speeds. However, production LPKF MicroLine UV lasers are also available with higher power. If you would like additional information, please feel free to email our sales team directly through [email protected].

Hi Rejoy, To get in touch with a representative in your area, please visit www.lpkf.com/contact/index.htm

Adrian Mutimer Yes, Laser Plastic Welding could work. Let's do a tech review. You'll want to get in touch with Dax Hamilton, his phone number is 503-454-4213. You can also contact LPKF through email at [email protected] and we will get you to the right person for this application.

The ProtoLaser U3 beam is focused on the material using a theta lens, and it also operates in smaller scan fields (generally 50mm x 50mm, but this is adjustable) within the 9” x 12” work area so that the angle of impact is as vertical as possible. The X/Y table is stationary while the laser is operating, but then moves to align each new scan field. This repeats until the full design is complete. Thanks for your question, and definitely let us know if there is anything else we can help with.

LPKF North America I really thank you for your reply. After you answered I did a small search and found some results like telecentric scan and get some idea to understand this amazing system's a small part. Your products and customer relationships are esteemable...

No problem at all stjohn, and thank you for your questions. Our software has preloaded templates for different materials which are based on previous trials. However, due to small variances in material, it is common practice to do a test run and then adjust settings if necessary to ensure that the laser is burning completely through the copper and stopping at the substrate. Once the contours and hatches have performed a complete isolation of the design, the material is ready for delamination.

The hatch process cuts the copper into strips. The width of each hatch is an adjustable setting, but for the ProtoLaser S the minimum is 25 µm. Our ProtoLaser U3 uses a smaller beam so it can hatch down to a width of 15 µm.

There are actually two different processes in this video, the first part is showing the laser creating the hatches or cuts in the copper. Then at the 1:03 minute mark it shows the delamination which is achieved by an air knife removing the chunks of copper from the substrate. This patented hatch and delamination process is distinct from ablation. By using this method with the air knife, we are able to remove copper much more rapidly than ablation. As for the focal point of the laser, that is stationary, the table moves up and down to position the copper into the focused portion of the laser. Thanks and definitely let us know if you have any additional questions.

Hello stjohn gold, it’s because we can control the depth of the laser down to 2 µm which is less than 1/10,000th of an inch. This minimizes any effect on the FR4 substrate.