Thank you!

Glad you enjoyed it

For sure! Our engineering team and production team have this expertise.

The air intake is on the bottom by the tube connectors. You can learn more from ExFog's own channel at kzbin.info/door/AN6r4PJbxOWba_Yei28AKg or email them at [email protected]

You are so kind!

¯\_(ツ)_/¯

The two heel straps, tested at the start of each shift, are effective.

The moving table works great. The machines handle a wide range of SMT components at excellent placement speeds and no parts fly anywhere.

We like their performance and flexibility!

Hope you're doing well! We talk about ESD control in the related video: kzbin.info/www/bejne/iIWyi2yFr7iGftU. A lot of factories seem more concerned about the "look" of things and set up practices that don't add to their effectiveness but just make employees unhappy. People like to express themselves with clothes, hair and jewelry and when they have the freedom to do that at work, it makes a happier workplace. Happy employees do better work.

Agreed. Let's focus on the essential part - reliable product.

Gloves are only clean until you touch some other surface with them. It's more effective to teach and practice good handling techniques: Boards are handled only by the edges, to avoid contamination.

This isn't a big concern a long as you make sure your stencils are working well, which is done automatically by the paste printer. We are considering adding a paste height measurement system but it's not really an issue in a temperature- and humidity-controlled environment, if you have set up the machine properly and regularly clean and maintain your stencils.

Here's an explanation of ESD protection and audit measures in the facility: kzbin.info/www/bejne/iIWyi2yFr7iGftU

I'm pretty sure you don't need an esd jacket to play with the stencil printer.

They use ESD heel straps.

It depends on your SMT equipment. Some pick and place machines move the placement head in all three directions (X, Y, Z) over a stationery board. Others move the head in two directions (X, Z) and move the board in the third direction (Y). Both techniques are fine. This modern Mycronic MY200DX machine has a 4 sigma placement accuracy of 35 um -- well capable of placing our 0201's (508 um long and 254 um wide) to much better than the IPC Class 3 standard.

you can set the Y-acceleration for each package the software uses the lowest that's already placed on the board for the Y movement. The bigger components like electrolites have a lower setting they are placed by the second machine with the larger single head, since the head has to go back and forth for each one the Y fasteness doesn't matter there. I've disabled the fastest setting on the second machine anyway for 'safety'. Sometimes you have to 'repair' a board or place a component that came in late so you have to feed the board in the machine for a second time with all components mounted the machine will load the board at the fastest setting in that case because it thinks no component is mounted yet. That will wreak havoc with heavy coils running wild and destroying everything in it's path like an elephant.

Sorry for the late reply. Yes the components will be sticking down in the solder, but the bodies are not metallic and solder will not wet to non-metallic surfaces.

Good eyes, Eileen! Everyone in manufacturing wears two heel straps, which is acceptable ESD protection per the JEDEC standard JESD625B. The heel straps are tested twice per shift. These grounding straps are only the last line of defense against ESD, which goes much deeper at Z-AXIS. For more details see our related video kzbin.info/www/bejne/iIWyi2yFr7iGftU .

Heel straps are visible in video at 3:31.