ADAT3 XF TwinRevolve: the game changer in flip-chip die bonding

The ADAT3 XF TwinRevolve flip-chip die bonder assembles up to 60,000 flip chips per hour, which is at least five times faster than anything else on the market. The new Flagship machine is a game changer, offering a fraction of the Total Cost of Ownership (TCoO) of previous die bonders.
The new die bonder simplifies the assembly process. Twin rotating heads mean less inertia and vibration than the conventional forwards-and-backwards motion. The die is flipped and placed in a fast, smooth action with the same accuracy but at much higher speeds. And - as with the whole ADAT3 XF (eXtended Flexibility) family - the machine is automated, modular and field upgradable for extended lifetime and even more sustainable operation.
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