Benefits of .XT interconnection technology for Discrete Power devices

Modern applications call for greater efficiency and increased reliability. For high power demands, oftentimes these requirements are met with power modules. Yet, through the introduction of a unique manufacturing technique known as .XT interconnection technology, this performance can also be achieved with Infineon silicon carbide discrete devices. This presentation will introduce .XT interconnection technology and show how it uses a diffusion soldering process to achieve better heat dissipation and reduced thermo-mechanical stress, even in harsh conditions.
Ajith Kumar Sekar’s presentation on the Passives & Magnetics-Day at Bodo’s 2022 WBG Event.
He is Senior Engineer for Discrete IGBTs and SiC MOSFETs at Infineon Technologies Austria AG.