Co-Packaged Optics for our Connected Future

Presentation by Tony Chan Carusone, Professor of Electrical and Computer Engineering at the University of Toronto and Chief Technology Officer at Alphawave Semi, on co-packaged optics, how it fits into the broader context of the evolution of integrated circuit I/O, and the opportunities and challenges it presents for the future.
The presentation was delivered March 23, 2023.

[@telugujoshi]

Super condensed but very clear explanation which touches on all the questions I had on Optical Interconnect.

[@simeonradev7174]

Thank you for posting this lecture. Very efficiently communicated and pertinent 🙂

[@nathanclin70]

Great talk! Such clarity and logical flow!!

[@rajkrish4702]

Great talk

[@peterdoyle8571]

What about a glass based motherboard that holds all the optical waveguides lasers etc. the plug and play chips could then be manufactured based on a standard for a pin or glass beed based input output from their own glass based bonded substrate. In essence many of the copper pins and tracings would be replaced by waveguides and standardized plug and play interconnects powered by standardized motherboard lasers.

[@IcRDlayout]

CoWos technology of Tsmc ❤👍

[@arashyusefi1889]

Thanks Microelectronics