Co-Packaging of Optics for HPC (High-Performance Computing) and Datacenters

[@BenjaminFasano]

I'm just seeing this now. A very thorough documentation of a long history of optical packaging at IBM. So far ahead of its time. It does a very good job of highlighting the technical depth needed to ensure the systems are reliable in the field. Early IBM systems were essentially owned from ceramic powder/silicon wafer boules to machines on the floor. Costs drove outsourcing (make vs buy = reduced headcount) and this meant less control over the quality and often more Task Force activity, which are extremely serious at IBM. It was a great time to be creative in designing and assembling OE packages. The current success of systems is very dependent on suppliers and their ability to comply with your well thought out specifications that consider multifactor tolerance analysis for other components when assembled. You better be technically paranoid or you're in for unpleasant surprises..

[@silberlinie]

Please please please, only half as many uuhms please please. This is absolutely cruel.