Heterogeneous 2.5/3D Chip Design Requires Integrated Tools

The latest high performance chips often employ 2.5D and 3D chip technologies like chiplets to deliver their functionality within the required cost, power and performance requirements. Companies are moving from system-based optimization to design-based optimization as system design and packaging become more complex.
Kevin Rinebold, Account Technology Manager for Advanced Packaging at Siemens EDA talked about the changes in the industry and Siemens’ tools that address this space and the Siemens “cockpit.”

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Excellent interview. Nice job KR!