High-Speed Wafer Feeder Flip Chip and Bare Die Process

This video features our FuzionSC™ and High-Speed Wafer Feeder, demonstrating a bare die process application. The bare die application process involves using semiconductor dies-tiny blocks of semiconducting material on which functional circuits are fabricated-without packaging them in traditional protective enclosures. This process has a wide range of applications across advanced electronics and technology fields, including Advanced Microelectronics, Microprocessors and GPUs, MEMS (Micro-Electro-Mechanical Systems), Implantable Devices, Aerospace and Defense, Consumer Electronics, and telecommunications.