High Thermal Performance TIM (Thermal Interface Material) for Lidded FCBGA Products

The need for high thermal performance semiconductor packages, such as lidded Flip Chip Ball Grid Array (FCBGA), is increasing for the next high-end central processing unit (CPU) semiconductor devices. However, today’s major polymer thermal interface materials (TIMs) have limited thermal conductivity. Also, because the polymer TIMs are located between the heat spreader (metal lid) and device die backside in the lidded FCBGA structure, assembly quality is critical to achieving low thermal contact resistance for high thermal dissipation performance. Therefore, optimal TIM selection is essential for enhanced thermal performance at the package level.
Presented by YoungDo Kweon, Sr Director, Research and Development, Adv. Flip Chip and Wafer Level Development at Amkor Technology
Originally presented at IMAPS Device Packaging Conference, April 12-15, 2021. Visit Devicepackaging.org for details about next year’s Conference.