The cartoon shows a wire bonding process from a bond pad on a chip to a lead of a package. The process is known as ball bonding. Many terms related to the process, such as loop height an wire length, are illustrated.
Пікірлер: 16
@johnloviearnado62025 жыл бұрын
thanks for the video it gives me the basic knowledge in wire bonding process that helps a lot in my job as technician.
@BruceLee-ju1bx3 жыл бұрын
Thanks for the visual presentation.
@jarren9878 Жыл бұрын
thanks for this video,.may i ask, can we reduce time for search pad and lead?
@jarren98787 ай бұрын
facing EFO small ball detected, fire level already check ok, but ball also ok, dont know why facing efo small bond
@andreaskampfrath64802 жыл бұрын
If there are any questions about wire bonding, I would recommend a seminar at a company in Berlin, Germany. There are also online seminars available, very competent.
@rakeshnaidu49533 жыл бұрын
Hello thanks for the video..i have few queries regarding this.. What all wire sizes available in this technology using copper material and does current carrying capacity of this joint purely depends on cross section area of wire, then how much current does 0.38mm dia of copper wire can carry....It will be very helpful if u are able to answer my queries
@nichthier8d2398 ай бұрын
You know, I really wonder what kind of people are interested in wire bonding but can't calculate the resistance/load capacity of a copper wire
@jarren98785 ай бұрын
50um cupper wire
Жыл бұрын
how to bonding with Au-Ag wire in image sensor
@lamgaming40494 жыл бұрын
can you explain about nsop&golf ball bond problem in wirebond?
@jarren98785 ай бұрын
your pad something not good
@boogerking74115 жыл бұрын
How did the free air ball formed?
@rickmanuzonnicdao63885 жыл бұрын
Starts at 0.57 Free air ball formed after firing the wire tail using EFO.