The Path to 1,000-Layer 3D NAND

For decades, Lam Research has been a leading provider of manufacturing equipment solutions that advance vertical, lateral, and logical scaling in semiconductor devices. Today, artificial intelligence is driving the development of the most complex chips ever built. As we navigate the complexities of the AI era, the path to 1000-layer 3D NAND represents more than just a technological advancement; it symbolizes a leap toward meeting future data demands. Hear from Harmeet Singh, GVP and GM of Lam’s Etch Product Group, about what comes next on the journey to 1000 layers.
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