Semiconductor Part 1 - Fabrication
19:05
Packaging Part 14 - AiP Deep Dive
20:25
THz  for Physical Assurance
15:12
2 жыл бұрын
Research Video Making Process
13:30
2 жыл бұрын
Packaging part 7 -  System in Package
19:36
To become a Grad Student in our lab
45:57
Packaing Part 4 - 2.5D and 3D
18:24
3 жыл бұрын
Пікірлер
@bahadratay6532
@bahadratay6532 2 күн бұрын
Great video series. Which tools are used to design the interposers? PCB tools and Gerber files as output OK?
@celebratedrazorworks
@celebratedrazorworks 27 күн бұрын
Excellent rundown! Ty.
@kailiugm
@kailiugm Ай бұрын
great presentation, do you have the slides that can be shared?
@benyomovod6904
@benyomovod6904 Ай бұрын
No Mr Die, I want you to Bond
@郭婷瑜-c5n
@郭婷瑜-c5n Ай бұрын
Is SiP the transition technology to achieving SoC so far? or is is a way better solution than SoC?
@joysca2476
@joysca2476 Ай бұрын
IDM
@imranahmad_in
@imranahmad_in Ай бұрын
Very Informative lectuer thank Prof Navid !
@jamesmoeller9366
@jamesmoeller9366 Ай бұрын
Well done, Navid!
@ZeyenH
@ZeyenH 2 ай бұрын
不错
@falconi7633
@falconi7633 2 ай бұрын
On slide WLP Challenges: "Nickel" instead of "Nitrate" for UBM?
@nosyajdi1910
@nosyajdi1910 2 ай бұрын
nice! thank you
@MrBubblegumx
@MrBubblegumx 2 ай бұрын
For mold first the carrier wafer is only needed during molding, right? Why does it have to be silicon?
@shaharbenharosh4147
@shaharbenharosh4147 3 ай бұрын
correction no. 2: (15:35) - there are sockets for BGA;
@shaharbenharosh4147
@shaharbenharosh4147 3 ай бұрын
Motorola 68020 has PGA package from 1984
@AnujYadav-on9oh
@AnujYadav-on9oh 3 ай бұрын
Please share your contact details Please
@urimtefiki226
@urimtefiki226 3 ай бұрын
Things that I can learn for one month it takes five years since 2019.
@urimtefiki226
@urimtefiki226 3 ай бұрын
Now computer design tools actually integrate all of these domains 9:26 kind of their own in the background. My algorithm is doing that configuration through 'Logical optimization'.
@urimtefiki226
@urimtefiki226 3 ай бұрын
Stacking of ICs one above other in layers connecting them together.
@eliahalteh1305
@eliahalteh1305 3 ай бұрын
very good lecture
@JohnPaulHo
@JohnPaulHo 4 ай бұрын
Take a look at entire series
@goldendragon776
@goldendragon776 4 ай бұрын
Thank you very much☺
@sunkarasaigoutham
@sunkarasaigoutham 5 ай бұрын
Amazing video !
@yahyanegintaji1058
@yahyanegintaji1058 5 ай бұрын
سلام و احترام جناب اسدی.ممنون از آموزشهای بسیار خوب شما. جناب اسدس من دانشجوی ارشد فوتونیک در ایران هستم و دنیال یک مثال آماده nonlinear micro ring resonator هستم.آیا شما چنین مثال آماده ای که با FDTD شبیه سازی شده باشد دارید؟ یا منبع و پایگاهی سراغ دارید که دانشجویان فایلهای شبیه سازی شان را به اشتراک بگذارند؟
@qianlee9621
@qianlee9621 5 ай бұрын
reading peed is too fast to follow
@jatigre1
@jatigre1 5 ай бұрын
I can't wait for engineers to start writing software in a form that can be read by these systems, so we'll finally have software and hardware unified.
@victorbeysmith
@victorbeysmith 5 ай бұрын
Thanks for the comprehensive overview!
@jamesmoeller9366
@jamesmoeller9366 6 ай бұрын
Daniel, Nice overview Please consider a takeaway statement at the bottom to highlight your conclusive intent 1,000 points
@supersuperANANAS
@supersuperANANAS 6 ай бұрын
awesome lecture, thank you!
@azamat_bezhanov
@azamat_bezhanov 6 ай бұрын
What can you say about durability, long lifespan of Power management IC units in Chiplet
@azamat_bezhanov
@azamat_bezhanov 6 ай бұрын
When will we get 2nm with chiplet packaging
@azamat_bezhanov
@azamat_bezhanov 6 ай бұрын
When will we get 2nm with chiplet packaging
@gokulg6833
@gokulg6833 6 ай бұрын
Is it possible to get the slide deck?
@ruiz.9751
@ruiz.9751 6 ай бұрын
good video 🙏 but it's awkward for a package substrate introduction video, ABF is not mentioned at all....
@qemmm11
@qemmm11 7 ай бұрын
all big and great company in the world😮
@Showrov16
@Showrov16 7 ай бұрын
Very informative
@m.-j.carlli3746
@m.-j.carlli3746 7 ай бұрын
Great video!
@yahyanegintaji1058
@yahyanegintaji1058 7 ай бұрын
سلام و احترام جناب اسدی. امکان راهنمایی و کمک در انجام پایانامه رشته فوتونیک وجود داره برای شما؟
@casiof21
@casiof21 8 ай бұрын
Many thanks.
@electricalnguyen
@electricalnguyen 8 ай бұрын
Thanks a lot Dr. ❤
@123munguia1
@123munguia1 9 ай бұрын
Great video, seems like you put the same section once, when talking about thermal reflectance microscopy, please check it out, thanks!
@郭婷瑜-c5n
@郭婷瑜-c5n 9 ай бұрын
the clearest explanation for interposer. I have been confused for a long time.
@lman333
@lman333 10 ай бұрын
Well done. Now understand what an interposer is. Thanks!!
@modorikr
@modorikr 11 ай бұрын
Very interesting and good to know to learn 3D packaging for beginner! Thanks to share
@subramaniana4576
@subramaniana4576 11 ай бұрын
Very useful keep making videos
@fangchen6721
@fangchen6721 11 ай бұрын
greater power, more thermal issues😀
@richh9366
@richh9366 11 ай бұрын
Dr. Navid is treasure. Really enjoy all of his presentations and learn so much.
@Jeff-q1v
@Jeff-q1v Жыл бұрын
In 1992 Motorola designed and created 1200 pin CBGA's for the PCB's on the Iridium payload.
@anthonyosullivan9625
@anthonyosullivan9625 Жыл бұрын
Thank you so much for these videos. Easily the best I have seen in my 8 years in the industry.
@anthonyosullivan9625
@anthonyosullivan9625 Жыл бұрын
These presentations are very good, but sadly RUINED by constant advertising every few minutes.
@PeterWang-oc1in
@PeterWang-oc1in Жыл бұрын
Hello can I get your presentation file?
@rayanemazari4591
@rayanemazari4591 Жыл бұрын
Thank you
@lingdeer
@lingdeer Жыл бұрын
Great video! 👍 thank you!