Surface Mount Process

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@johnsmith-pcb 19 күн бұрын

Please what is the brand and model of your microscope ? THANKS

@ernyvga389 24 күн бұрын

What's the soldering wire width?

@9sadra9 Ай бұрын

nice

@JENNISJOSHI Ай бұрын

FCBGA1168 socket (BGA - Ball Grid Array) SO I CAN CHANGE MY CPU?????????? PLZ REPLY

@rubhern8187 Ай бұрын

After finishing solder do you clean with ipa or other specified chemical like chemtronics flux off?

@SurfaceMountProcess Ай бұрын

Lint-free IPA wipes are best used to clean off flux residues after soldering

@RJHElias 2 ай бұрын

Could you tell me what kind of flux you use? It works perfect! 👍

@hectorgomez7185 2 ай бұрын

Donde lo puedo descargar ?

@Bedfford 2 ай бұрын

great! what temp is adequate for the heat gun and proper/brand for flux? thanks!

@SurfaceMountProcess 2 ай бұрын

When reworking BGA's using a hot air tool it is good practice to preheat the assembly to between 100°C to 150°C (212°F to 302°F) to reduce thermal shock and then set the hot air tool to a temperature dependant on the solder alloy used - Typical Range: 230°C to 250°C (446°F to 482°F) for SAC alloy with a melting pont around 217°C to 221°C (423°F to 430°F). For reworking a lead-free BGA with a hot air tool, a no-clean flux (like RMA) is typically the best choice due to its ease of use and minimal residue. It is recommended to use a flux with a high viscosity, like a gel flux to help steady the component during rework

@Bedfford 2 ай бұрын

@@SurfaceMountProcess superb!

@kaz0271 2 ай бұрын

leadfree solder right....looks like crap.

@SurfaceMountProcess 2 ай бұрын

Leaded solder always flows better

@bastelmannalexa7039 Ай бұрын

Это Вы просто не умеете паять...

@wesmcdaniel8686 2 ай бұрын

Are there window panes to let the gas out? You only need 50% coverage on the ground pad.

@SurfaceMountProcess 2 ай бұрын

Hi, the stencil aperture for the ground pad was windowed but was too large causing too much much paste to be deposited

@ayan.debnath 2 ай бұрын

Just ART!

@pinfantw2001 2 ай бұрын

May I know how long this took?

@SurfaceMountProcess 2 ай бұрын

Under typical conditions in electronic devices, dendrites might take from hours to several months to form. In accelerated test conditions (such as high humidity, high voltage, and the presence of contaminants), dendrites can form within hours to days.

@owenchang2581 2 ай бұрын

Yes. Actually, I guess you might apply flux on it to accelarate this even in room temperature. So I just need to know how long you took.😅

@owenchang2581 2 ай бұрын

I am trying to verify a new material SIR performance by comparing it with pure copper. Just want to know how strength the new material is in SIR.

@jiewen2327 3 ай бұрын

cool

@Vitalii-R. 3 ай бұрын

In a real practice people don't use a stencil for a solder paste if the pads are tinned.

@carpandrei7493 3 ай бұрын

What would be the approximative range of resistance that these dendrites can have? For 0603 package for example, are we talking hunders of kOhms or much lower?

@SurfaceMountProcess 3 ай бұрын

Thanks for the question - The resistance of dendrites can generally be expected to range from a few ohms to a few kilo-ohms for metallic dendrites and up to mega-ohms for non-metallic or mixed composition dendrites. This variability is due to the influence of material properties, dendrite geometry, and environmental conditions. Hope this helps :)

@mrsolderfix3996 4 ай бұрын

Remember people , this content was taken from Mr SolderFix KZbin channel . For real advice visit that site , not this one 👍

@luckywetland 4 ай бұрын

This is not your video. It's from @MrSolderFix channel. Stop stealing other people's work kzbin.info/www/bejne/lWeyiZVood2XjKssi=b2PVALs-ZoiYdtPV&t=123

@NyukChoonLai 4 ай бұрын

may i know how long for these dendrite to grow?

@SurfaceMountProcess 4 ай бұрын

The time required for dendrite growth in ECM failures can vary widely based on environmental and operational conditions. Under extreme conditions, dendrites can form within hours, while under milder conditions, it might take months or even years.

@NyukChoonLai 4 ай бұрын

May I know how long for these dendrite to happen?

@SurfaceMountProcess 4 ай бұрын

@motodin4210 4 ай бұрын

Such heaven when there's no component sitting so closely all around the BGA... I'm struggling 😭

@vbinamati 4 ай бұрын

Share that Soldering Tweezer purchase link

@21thTek 4 ай бұрын

Super !! ⭐⭐⭐⭐⭐

@stevenstoddard1588 5 ай бұрын

That is amazing

@bartoszmarduk7590 5 ай бұрын

Temp?

@luizmoura7393 6 ай бұрын

What soldering flux is this in gel form?

@boriszinchenko5885 6 ай бұрын

Show how to solder with HMP PCBAs with massive heat sink

@fridaynighthikes 6 ай бұрын

Is there enough solder left to reattach the BGA?

@electronicscaos 4 ай бұрын

Doing both sides cleaning and soldering, actually yes. Been doing it for years without having rework to do later.

@viktorgorbunov 6 ай бұрын

2x thermall stress. Some components like big mlcc's, didnt allowed to use soldering iron.

@tygrua8337 7 ай бұрын

🧐

@AndriiAndrosovych-u8e 7 ай бұрын

The smallest component that I soldered few years ago - 0402. But 008004.............

@Atom224 7 күн бұрын

Yeah, reflow oven only. Hot air would blow it across the fking room

@ekfariant3159 7 ай бұрын

Saya hanya memiliki solder biasa dengan ujung runcing dan daya 40w, apakah dapat di gunakan untuk Menyolder ic qfp?

@nstorm00 9 ай бұрын

If taken from the electronic side, the only real difference on 1st pair of pictures are missing C53. Rest either makes no difference (like marking on the 0 Ohm resistor, or U2 silk) or requires additional info to know if it makes any (but usually it's not, like missing testpoints and pad might be not connected anyways, different FPGA marking might be just other batch change in marking, etc).