Surface Mount IC Lifted Lead Coplanarity Fault during Reflow Soldering

Surface Mount IC component lifted lead or coplanarity issues refer to a situation where the leads or terminals of a surface mount component (SMC) are not flat and not soldered to the PCB pads during reflow soldering. This lack of coplanarity can result in various problems, including poor solder joints, electrical connectivity issues, and mechanical stress on the component. To ensure the coplanarity of SMT component leads, a coplanarity visual check is performed by the component placement machine.
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