Advancing Moore's Law with Backside Power Delivery

Behind nearly 60 years of Moore’s Law lies a continuum of transistor technology breakthroughs that push the boundaries of what was once thought possible. Backside power delivery is one of those breakthroughs, a key innovation in the industry’s pursuit of ever smaller, denser, and more powerful transistors. Today, power and communication lines within a chip’s transistor architecture share the same resources. With backside power delivery, power and signals no longer compete for the same resources, enabling better-performing, more energy-efficient chips for customers. To understand the technology’s impact on continuing Moore’s Law and what it means to chip designers, Pat Moorhead catches up with Ben Sell, Vice President, Technology Development, and Eric Fetzer, Intel Fellow, Technology Alignment and Pathfinding, Design Engineering Group, on Intel’s PowerVia approach to backside power.

[@azamat_bezhanov]

What can you say about durability, long lifespan of Power management IC units in 2nm backside power delivery technology

[@azamatbezhan1653]

Self heat effect. What can you say about it

[@BigEightiesNewWave]

I am waiting for desktop Arrow Lake, the one that has PowerVia AND ribbon-FET.

[@seanjorgenson7251]

They are working with Atomera