Рет қаралды 1,186
Origins and Rise of Integration:
Evolution of Packaging Technology
Chiplets
Transition from Monolithic integration to Heterogeneous Integration
Connections to Chiplets
Challenges and Solutions: Heterogeneous Integration:
Challenges and Solutions: Die-to-Die (D2D) Interfaces:
Types of chiplet Protocols:
UCIe Vs PCIe
A list of interconnect standards used for data transfer
UCIe layering
UCIe PHY
Serdes Tx and IOs
Serdes Receivers