Discover: die-to-wafer hybrid bonding | CEA-Leti

Discover CEA-Leti expertise in terms of hybrid bonding: the different stages of die-to-wafer process in CEA-Leti clean room, starting with Chemical Mechanical Planarization (CMP), through die-to-wafer bonding, alignment measurement, characterization of bonding quality and grinding.
#HybridBonding #3D #packaging
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[@chandrashekharrahurkar6583]

❤

[@stefan5697]

This impressivley show the spirit and creativity of the semiconductor industry.

[@jasonjin9347]

非常漂亮的制程展示，谢谢。

[@azamatbezhan1653]

What can you say about durability, long lifespan of Power Management IC units in chiplets

[@azamatbezhan1653]

What we will see in 2027 in term of implementation 2nm chiplet packaging in consumer gadgets.

[@user-ei1pe5dz3h]

u'll im problem plz complete!

[@Cunch]

Very cool!