Flip-Chip Underfill: Pushing Boundaries in Semicon Packaging in cooperation with Fraunhofer IZM

#Microelectronics #Semicon #Seminconductorpackaging
In the realm of microelectronics, adhesive bonding plays an indispensable role.
Following initial testing, these test vehicles will elevate capillary underfill adhesive development for fast-flowing, low-viscosity, extremely reliable adhesives. This project has taken us to new limits, offering us an invaluable lesson in adhesive capabilities. Not to mention, collaboration is essential in order to integrate diverse expertise.
In this video, we’ll show you how we assemble complex test vehicles for advanced fine-pitch applications, thanks to the rich expertise and outstanding technical capabilities of Fraunhofer IZM (www.izm.fraunh....
Many thanks to Delo for providing the video.
Credits: DELO www.delo-adhes...
#microelectronics #Semicon #Seminconductorpackaging #Collaboration #AdhesiveInnovations #Fraunhofer