Inside the Intel 4 Process and Foveros Packaging for Meteor Lake | Talking Tech | Intel Technology

[@KirkWheeler-p2o]

As an intel R&D engineer, i was excited to develop the first extremely fast Die to Wafer (Thermal Compression Bonding) attach process Pat Stover was talking about. A great team to work with to make unbelievably complex ideas a reality.

[@thefreemonk6938]

How to become like you?

[@__aceofspades]

Intel is more exciting now than they have been in the last decade. New nodes every year, Foveros (tiles), new architectures (P-core, E-core, GPU), NPUs (AI accelerators), new design philosophies, you name. Intel is doing so much right now. I am hoping I am able to pickup a new Meteor Lake laptop for Christmas!

[@marsovac]

yeah AMD shook them and they started to actually improve designs, but what is still lacking, and continues to lack is the processes and fabs. Foveros requires more than half of the stuff fabricated in TSMC. To be competitive they need to produce in house. But they cannot because they lack the technology and process to do it.

[@licson0729]

@@marsovac I think most chiplets on Meteor Lake processors are produced on TSMC process is because those parts don't need high performance and Intel 7 production lines are busy pumping out processors so they don't have enough capacity to produce those parts in-house. As fab capacity expands, I do think Intel will take more chiplets to in-house processes.

[@runninginthe90s75]

@@marsovac AMD got hard carried by TSMC, if they still produce their own chip using Glofo like their joke powerhungry nuclear reactor AMD bulldozer/FX then they will be destroyed really hard by Intel specifically when Intel able to beat TSMC at manufacturing process.

[@runninginthe90s75]

@@licson0729 True, capacity is the biggest problem of Intel. Honestly they can use Intel 4 for all tiles on meteor lake chip such as GPU then again it will means they will sale less chip which is not good idea. Also they don't want to repeat AMD big mistake by not shipping enough chip to laptop vendor.

[@EnochGitongaKimathi]

I'm glad to see Intel working hard to regain manufacturing leadership. I appreciate how complex and difficult it is to keep innovating and moving technology forward. Glad to see Intel on EUV, can't wait for High-NA.

[@runninginthe90s75]

I have very high optimism with Pat Gelsinger as leader, so far Intel has been solid since Alder Lake launched, even Pat able to makes Intel selling decent GPU too for budget gamer, honestly what Intel is really lacking right now is advertisement, you guys need to show your ads again on TV just like in old days when Core 2 family CPU launched or when Intel Core i first comes out, so more people will know how great your CPU and GPU !

[@matthewhayes7671]

Thank you to Alex and the entire production team for bringing us this amazing content. We love you!

[@01ai01]

Love this kind of content, awesome to see some of the details behind the new processes!

[@j340_official]

Thank you for bringing this to us. I really appreciate giving us insight into the world of chiplet hvm. Good luck with meteor lake and the future lakes, we are rooting for you to come back. 14 -> 10nm was a challenge but we look forward to Intel 3, 20A, 18A and beyond. And we look forward to thunderbolt 5 as well. Would love to see more of these videos. Especially when 20A is in HVM. Good luck!

[@kubilayakaslan]

Energy efficient, AI capable and also place saver. 4 in 1, It is like an instant coffee. An oven , a fridge or a car equipment , something that needs this sort of chips will want to use these new design eagerly.

[@cwbh10]

This isn't a flashy video and thats awesome because it shows there is some really real cool tech coming out. So excited to see how Intel changes and grows this decade!

[@velo1337]

really hope you guys can compete in power efficiency.

[@Erik-rp1hi]

I'm just an enthusiast and have been following this stacking of chips to a base chip. What I don't yet understand is how the top chips have the wire paths through the silicon wafer to connect to the base chip. Bored through holes?

[@cirozorro]

Same as it always was with monolithic chips which have thousand of connections to the substrate pcb package, this just had an extra silicon landing pad that connects both bottom and top and acts as a large interposer/ multiconnect. It's not bored through holes. They are built up Vias. Usually utilizing a combination of cvd, pvd plated and electrochemical plating.

[@KirkWheeler-p2o]

Its an interesting process. Sadly, i clearly cant share how i developed our first certified die to wafer attach process.😉

[@ScoopDogg]

x2 more legs and lanes : (

[@ericreinhart9795]

Im rooting for you Intel. Take back your throne.

[@MrHav1k]

Intel is back!!!

[@runninginthe90s75]

Intel is back to destroy competition and we all fot it !!

[@RichWithTech]

It really is starting to feel like intel is back on top

[@runninginthe90s75]

They will shake up entire industry like in old days and gain market leader position with the first chiplet cpu aka meteor lake.

[@Core2]

Amazing stuff!

[@netbat4399]

meteor lake is power efficent. waiting high performance intel 4 node cpu when 7ghz cpu possible, intel is the only company sell cpu have highhest frequency on the world

[@bits2646]

Intel 3 sound like to me more like a node variant more like a new separate node, sth like N3P, N3B, N3X from TSMC for example... P.S.: I know nothing about that process in detail, it's just how it seems to me.. But I love those kind of videos, makes you know the brand and products better

[@licson0729]

Indeed it is! Intel 3 is supposed to be a complete node with high performance, high density and IO optimized transistor libraries (also +18% density if official spec are true) as Intel 4 only offers high performance transistors.

[@LeicaM11]

So Intel is having 1.8 nm today! Directly by TSMC? Where and when to buy? What did Apple get then?

[@HuntaKiller91]

The igpu is on par with 780m Quite good but i expected more Come on u gaisss

[@NoSpamForYou]

Only in fake benchmarks.

[@tarikzakzouk8549]

Somehow they remind me with the soviet union. Their mentality is still stuck at 10 nanometer.

[@Gilga66]

i guess this is the reason they have nothing to fight zen 5 for most of 2024

[@ouulriyac4747]

Very sad to see a company with such legacy messing up node decisions, hope to see them back with node leadership parity sometime in the future 😞

[@tropicthndr]

They can’t catch up because they’re not admitting that arm based chips are ten times more efficient and better in every way. Which is why everyone else has seen the light and are dumping these morons and their x86 stupidity.

[@runninginthe90s75]

Intel future with Pat Gelsinger is so bright. Intel has been competitive since gen 12 aka Alder Lake launched also they gains many profits even beat the expectation. Also since Pat era Intel able to makes GPU and even being competitive which is impressive for first gen. I don’t see any reason of why they won't success with meteor lake. Mateor lake will be another shake up to AMD and Apple just like when Alder lake released.

[@eric-pl6rk]

Still at 7nm process. Apple is already at 3nm.

[@runninginthe90s75]

TSMC 3nm is not real 3nm, they are actually 5nm. Also Apple is trash, their M cpu is total joke. Even with 3nm they only gain 5% improvements over previous gen, not to mention A17 is total failure too because the chip is too hot even for using "3nm ". Meteor lake with Intel 4 will destroy overrated garbage Crapple M series chip at performance and efficiency. No doubt.

[@user-lp5wb2rb3v]

i hope you know that apple uses tsmc

[@marsovac]

Fix your in house process and manufacturing ability and capacity. It is nice to have tiles, AI, and hypbrid cores, but it all falls short if you need to use TSMC for half of it. TSMC is the world bottleneck, and by bottlenecking it even more we won't have cheaper and more readily available processors and GPUs, especially since their leading process is completely booked up by Apple and China might interfere in the near future due to US export bans. We need Intel to be a competitor to TSMC, not just AMD or nVidia.

[@runninginthe90s75]

Capacity is the biggest problem of Intel. Honestly they can use Intel 4 for all tiles on meteor lake chip such as GPU then again it will means they will sale less chip which is not good idea. Also they don't want to repeat AMD big mistake by not shipping enough chip to laptop vendor.

[@user-lp5wb2rb3v]

they are doing this by offering to make amd chips

[@ramseyrodriguez8515]

How are they in track, when Intel 3 was slated to H2 2023? 2023 is almost over.

[@sitechca70]

Watched this hoping to learn something but it was more of a PR piece than "inside the Intel 4 process....". Independent streamers do a better job explaining Intel tech.

[@FeintMotion]

Same way as 3 years ago

[@runninginthe90s75]

@FeintMotion Same trash comments as 3 years ago

[@FeintMotion]

@@runninginthe90s75 Well yeah why change when the architecture doesn't lol

[@ChipChatCentral]

Amazing

[@MaeVisage]

Show us how Arrow Lake Desktop 15th Gen. CPU was made next year in 2024.

[@runninginthe90s75]

They will announced it next year. For now they are focused on meteor lake which is the foundation of Arrow lake / gen 15.