Introduction to Chemical Mechanical Planarization/Polishing (CMP) in Semiconductor Fabrication

Chemical mechanical planarization (or polishing), or CMP, is a critical step that is used multiple times in the semiconductor manufacturing process at each layer of the wafer to remove excess materials and create a smooth surface. This is done through the interaction of a pad and slurry on a polishing tool. Pads and slurries are consumables used in the CMP process and should be selected based on needs for technical performance, process optimization, and/or cost-of-ownership.
DuPont is a global leader in polishing pads, slurries and application expertise for CMP serving the semiconductor chip manufacturing industry and other advanced substrate polishing applications. With decades of experience, DuPont offers a full range of polishing pads and slurries designed to meet the distinct performance needs of each CMP application and node.
DuPont’s CMP portfolio includes the Ikonic™, Optivision™, Visionpad™, IC1000™, Politex™ and Suba™ CMP pad families, as well as the Acuplane™, Novaplane™ and Optiplane™ CMP slurry families.
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