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Today, I tackled touch issues on an iPhone XS device, a common issue plaguing many users. Initially, I checked if the touchscreen connector was properly connected to the motherboard, but sadly, the touchscreen remained unresponsive.
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Moving on to the diagnosis, I used a tester to measure the impedance of the connectors. The red tip was connected to the ground and the black tip to the pads. After obtaining the values, I used a ZXW-type tool to verify that they were within the expected parameters. This process is essential to ensure the connector is free of defects and meets quality standards. It appeared that one of the pins was failing, causing a loss in communication.
To address this, I had to separate the iPhone XS boards, for which I used the Kaisi K303 Pro tool. This device heats the motherboard to 180°C, facilitating easier separation. Both before and after the process, a visual inspection is necessary to ensure the components were not damaged during the separation.
Throughout the process, I used flux, which helps improve quality, prevent pad damage, and reduce oxidation. When lifting the top layer, gentleness and delicacy are essential to avoid damaging the pads. On observing the result of the separation under the microscope, I saw that no pads were lost, which augured well for the success of the repair. It's noteworthy that in Spain, such repairs can range between 100 and 120 euros, reinforcing the need for professional assistance for such delicate operations.
Next, I tinned the pads using specialized tools. Cleaning the pads to ensure they are free of dirt and dust is crucial before applying a small amount of 183°C leaded solder. Before beginning the soldering job, I made sure to clean the work surface using a cotton wipe to remove solder residues.
After the soldering process, I examined the work done using a microscope, which showed the task was carried out effectively with great precision. Satisfied with the result, I proceeded to heat the pads with the tool at a temperature of 180-190°C evenly, thereby ensuring a reliable connection between the pads.
To melt the solder, I heated the motherboard to 180°C. Upon reaching the melting temperature, the solder melted and resulted in a perfect bond, also known as tin soldering. For rejoining the iPhone XS boards, I used a tool specifically designed to apply appropriate pressure for a firm and secure connection. This tool offers greater safety as it reduces the chances of short circuits or failures between the two layers.
After the laborious process of reballing and rejoining the boards, I then assembled the device and was thrilled to see that the touchscreen was now working correctly. It was a lengthy and meticulous process, but seeing the device spring back to life made it all worth it.
I'm Leonardo, and if you found this information useful, please like and support my content. I look forward to sharing more of my technical journeys with you. See you in the next video!
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