Laser hole drilling in thick silicon / Laserbohren von dickem Silizium

Drilling of many deep holes in thick silicon substrates can be done efficiently using Avonisys high-power IR waterjet laser systems.
In this video we drill a matrix of 100 holes of 1mm in diameter and 8mm deep, while each hole takes approx. 60s to drill.
Unlike conventional mechanical drilling and ultrasonic processes, there is no tool wear and no tool breakage risk.
Additionally the waterjet laser system can also make non-round holes such as ellipses, rectangles and squares.

[@yinfengliu8320]

深圳有人有这个机器嘛

Quite good video, awesome! Would you like to be KZbin friends? :]

[@raymondg.3173]

Great innovation. What's the part for anyways?

[@Avonisys]

It is a semiconductor process related part

[@Avonisys]

It is a semiconductor process related part

[@tootalldan5702]

What was the psi of the waterjet? And what was the wattage of the IR laser?

[@Avonisys]

our systems work in 180-400 bar range depending on application. Power in this case was around 100W Ave.