LER

LER #038
In this video we look at desoldering a small QFN without the use of hot air. This may be desirable in cases where there is something made from plastic (for example a DIMM socket) very close to the IC we want to remove.
So is it possible to do this without the use of hot air? I asked around on some internet forums and someone advised a method to do this - so I gave it a try. This results video shows the results of the experiment. Did I manage to desolder the QFN successfully? Watch to find out.
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Richard

[@VVerVVurm]

maybe some copper tape on top of the chip would help in spreading the heat to all four sides?

[@LearnElectronicsRepair]

Hi. Yeah that could possible help, if the copper tape was adhered well to the chip so it did not move and folded over so it touches pads on all the sides. That's good thinking. I'll see if I can find a way to test this idea on a future video. Thanks :D

[@KrotowX]

Your success here depends from ground/power layer thickness. On boards with thick ground layer and large ground contact area under the chip solder balls only will not work. Desoldering then is still possible in messy way - by drilling or sanding package top away till crystal. Then apply solder ball directly on crystal in 350C temperature.

[@timothyholder4187]

They make a low temp solder that you mix into the current solder . Once the low temp stuff mixes , the part comes off with very little heat.

[@Dutch_off_grid_homesteading]

Heya, did some desoldering myself on an old board some components were pretty easy (still have to get used to working with a microscope ) and others are pretty difficult to get the hole's empty of solder so need more practice