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This is a short demonstration on how to remove an SD Card Reader from a Galaxy S5 (Not an S6!) circuit board using Hot Air and Secondary Heating. The PCB contains an array of heat sinking and shielding components that make an otherwise simple removal, much more challenging.
The procedure was as follows:
1. Install the PCB into the ST 350 board holder. For minimal interference, use the special clamps to hold the board in place.
2. With an ST 400 Preheater, preheat the board on 150-180C for 3 to 4 minutes.
3. Once the board is hot to the touch or exceeds 100C, input a profile to ST 350. Ideal parameters are: 100-120 Seconds, Blower Speed 7-9, Temp of 750-775C.
4. Before starting the heating cycle, place a generous amount of liquid flux on the component. The more the better! Tacky flux would also be acceptable for this process.
5. Lower the nozzle to the component as close as possible, but not touching.
6. Commence the cycle. NOTE Due to this component's particular dimensions, the vacuum cup inside the nozzle head may fail in picking up the component once reflowed. Be sure to align the component to the vacuum cup as best you can. If not, use the handheld vacuum pick as demonstrated in this video.
7a. At the end of the cycle, the vacuum pick will engage automatically and grab the component. At this point, raise the heater head from the board.
7b. If the vacuum pick fails to pick up the component, use the handheld Vacuum Pick to lift the component from the board.
8. Once cool, remove the board from the board holder and clean off any flux residue before removing excess solder from the pads.
Thank You.