Reliability of Next Generation CPU GPU and FPGA s

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This talk will focus on semiconductor failure mechanisms like dielectric breakdown, electromigration, hot carrier effects, and negative bias temperature instability. Failure mechanism topics include discussion of the physics behind these mechanisms, thermo-electrical and physical conditions, and capturing their effects in test before a product is fielded.

[@gavbarnett]

Please synchronise slides with audio. Slides are running a bit fast. (handy there's a pdf though!). Thanks