Silicon wafer manufacture & patterning process

Okmetic SSP, DSP and SOI wafers with built-in patterns and buried cavities (C-SOI®) enable more optimized MEMS and RF manufacturing. Fully in-house process covering crystal growth, wafering, lithography, DRIE and fusion bonded SOI guarantee supreme quality and shorter time-to-market.
There is increasing demand towards turnkey, custom wafers and tailored wafer structures in the MEMS and RF device market. Okmetic’s SSP, DSP and SOI wafers with built-in patterns and cavities (C-SOI®) are customized to match customer device design and process seamlessly and they are manufactured fully in-house at Okmetic. This increases wafer quality and reliability significantly in addition to enabling more ambitious device designs and shorter time-to-market. The patterned wafers’ quality and cleanliness standards are identical with bulk silicon wafers.
Learn more about Okmetic's patterned wafers: www.okmetic.co...