Рет қаралды 328
The highest speeds, precision & stability, and fullest automation combine our new tool spindle (U)ASD-H20A. It was developed specifically to meet the long outstanding requirements for the production of integrated semiconductor devices and optoelectronic components. Shortages of electronic or optical components were the first signs of change. By 2026, an annual and required doubling of the production volume of electronic and optoelectronic components and systems is predicted. Existing production lines have reached their capacity and accuracy limits and are about to be replaced.
Our new spindle is the solution for the high request of productivity with small tools (spindle speed) and the drastic increase in automation (IoT/ i4.0). Speeds up to 150,000 rpm (or 120,000 rpm), an automatic springless HSK-E20 interface, tool clamping monitoring, and optimized thermal/ dynamic behavior allow fully automated machining of small and integral components. The ASD-H20A spindle is also optionally available with high-pressure aerostatic (UASD-H20). This almost triples the load capacity and robustness, especially at low speeds and with larger tools.
To the product page: bit.ly/3Lya53q
Send inquiries or questions to: info@levicron.com