Wire Bonding Shorts: Die Footprints

[@robertdixon8238]

Very interesting. Can this handle ribbon bonds as well?

[@yerzhankudabay]

Nice feature, but unfortunately it is limited in usability… For instance, if the bond pad on the chip is not at the edge, the bond wire intersects with 3D chip body. It is not possible to define the bond loop parallel to PCB plane. Also bond wires not exported as 3D body during STEP file export. Do you have a timeline for implementing these features? Thank you for your attention🙂