Empowering Sustainability: Advanced Packaging and Integration of Wide-Bandgap Power Semiconductors

This is a special research webinar by Christina DiMarino, Assistant Professor in CPES and Virginia Tech’s Department of Electrical and Computer Engineering. In her presentation, Dr. DiMarino discusses the world-class CPES facilities and the expansive capabilities they enable towards innovative power electronics packaging solutions.
Abstract: Power electronics play a crucial role in the transition toward net-zero climate goals by enabling efficient integration of renewable energy sources, electrification of land, air, and sea vehicles, and enhancing the energy efficiency of data centers and other critical technologies and infrastructure. Wide-bandgap (WBG) power semiconductors, such as silicon carbide (SiC) and gallium nitride (GaN), enable power electronics systems that meet these demands due to their faster switching, lower losses, and higher voltage ratings than conventional silicon power devices. However, new approaches to the packaging and integration of WBG devices are essential to unleashing their full potential. This talk delves into the evolving landscape of WBG power semiconductor packaging and integration, and the unique multidisciplinary packaging challenges posed by these devices. Dr. DiMarino will discuss CPES’ state-of-the-art packaging laboratories and instrumentation, innovative packaging solutions from select projects, and future research directions.

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For packing of the GaN for space application which can reach to cryogenic temperatures, what kind of epoxy or packing will be suitable .?