Influence of Through Hole Vias on PCB RF Performance

[@Vishrut.Dave94]

Great video for beginners as well.... Although I had to watch the entire video at 0.75x playback speed but it is still quite easy to understand with great amount of data is being presented. keep uploading more of these. Thanks a lot

[@blabinorbit9328]

Very interesting presentation. But where is the corresponding article? The Rogers Corp. website is incredibly impractical for searching documents! If I type the title in the "Document Library Search", I get 860 results and none of them seem to be relevant.

[@codydowling1120]

Excellent video- thanks. Very well explained and good supporting data! Regarding the use of multiple plated through hole vias in 4 layer board design for switching power converters used in audio... We use exclusively through vias and no blind or buried vias. Our target goal was to maintain the integrity of a square wave with fast edges used in switching audio amplifier designs. Assuming Sig/Ground/Power/Sig stackup, we try to minimize via inductance by replacing large (12mil drill) “power vias” with multiple (4-6) 6 or 7mil vias. With the information presented in this video, it would seem to support the approach, but would be very interested to hear your perspective.

[@CSparzo]

Excellent explanation

[@anneallison6402]

So if I have a matching network I can compensate the capacitive/inductive effect?

[@friedmule5403]

Am I right in assuming you did only use vias in the tracks? That you did not add impedance eliminating vias outside the track in parallel to the track vias? Do you know trough how many layers the impedance signal went? What about internal vibration? Sorry my many questions, just I have found the same but not with parallel vias if the board did not resonate. :-)