Intel Accelerated - Process and Packaging Innovations (Event Replay)

▶ Learn more about Intel's Process and Packaging Innovations: intel.ly/3HR4ylx
During the "Intel Accelerated" webcast, #Intel's #technology leaders revealed one of the most detailed process and packaging technology roadmaps the company has provided. The event, on July 26, 2021, showcased a series of foundational #innovations that will power products through 2025 and beyond. As part of the presentations, Intel announced #RibbonFET, its first new transistor architecture in more than a decade, and #PowerVia, an industry-first new backside power delivery method. #Semiconductors
▶ Learn more from #IntelAccelerated: intel.ly/31KZijL
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