PCB Dielectric Materials Construction | PCB Manufacturing

Technical Consultant Zach Peterson responds to a viewer question about PCB materials in today's video. He covers dissipation factor, dielectric materials, resin, and more!
0:00 Intro
1:00 Understanding the Materials List
2:43 PCB Material Constructions
7:26 Dissipation Factor and Loss Tangent
10:50 High Voltage vs. High Frequency
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[@FernandoCaT97]

Thank you so much, very usefull!

[@sigfreed11]

So glad you do these videos! I’m super interested now in high voltage dielectric selection. I had never heard of that until now. If we are working above 250V, what are the dielectric materials we should be leaning towards? Or maybe even better yet, what should we be absolutely avoiding?

[@Zachariah-Peterson]

So I'll give you the summary here: the best dielectric materials for high voltage have higher resin content with phenolic curing agent. Compared to phenol cured laminates, DICY cured laminates can have higher failiure rate due to CAF growth for a given voltage. Note that this does depend on the plating material because certain metal ions in the plating material may be more electrochemically active and can exhibit faster CAF growth.

[@hanli4977]

Very useful knowledge. Thank you.

[@AltiumAcademy]

Glad it was helpful!

[@TrangNguyen-mb1vn]

I am using Rogers RT5880 and trying to import it to material library, however I cannot find the *.xml file for it. What should I do? Is there any extra step to start high frequency vs low frequency PCB? Thanks!

[@Zachariah-Peterson]

This is a good question, I'll look into this. To be honest I do not normally use the material library, I normally get the data for the layer stackup directly from the fabricator. But I think this is important because the library is useful, especially if you always use a specific set of materials so I think I should make a video about it!

[@andrewpiotrowski9327]

Dissipation factor and new AI servers

[@Zachariah-Peterson]

AI accelerator cards or expansion cards in servers are definitely using advanced FR4 with low dissipation factor