S-King Product: Flip Chip Die Bonder (High Precision Solution)

Company: SHENZHEN SKING INTELLIGENT EQUIPMENT. CO., LTD
(stock code: 688328)
Sales Contact: [e-mail]
S-King (Shenkeda Group), a OEM Equipment Maker to provide automation manufacturing and semiconductor solutions for Assembly&Testing
[CP]: ChipProbing Station ...
[Die Bonder]: Epoxy Bonder, Soft Solder Bonder, Eutectic Bonder, CameraModule Attach Equipment, IGBT Multiple Chip Bonder, Tesla-package SolderPreform&Clip Bonder (T-PAK, ST-PAK process) ...
[Test Handler]: Turret, Tray, Tape&Reel, Pick&Place, Gravity Test Handler ...
[AOI]: Wafer Inspection AOI, Wire Bond AOI, Post-Bond AOI ...
[Cleaner]: Water Cleaner, Plasma Cleaner ...
[Pick and Place handler]: Customized design ...
[Curing Oven]: ...

[@tomatogroup1618]

Nice

[@aaroncai1991]

more info please reach my email, [e-mail]