The Next Big Wave in Chip Design. TSMC's WoW Packaging

In this video I discuss 3D microchips which will keep Moore's law going
#3Dmicrochips
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[@AnastasiInTech]

Let me know what you think!

[@masternobody1896]

can you make a video when we are going to have 100 times more cpu and gpu performance

[@masternobody1896]

and how

[@ricardoabh3242]

Always find funny when they try to wow effect with new terminology. They are already 3D ;) but to one of your point, I think heat is a major factor. I could argue, semantically, that the future is 2D+1D. A 2D layout could maybe profit of quantum behaviors, efficiency, lower heat, density… And integrate vertical, 1D to the next layer, that could be a heat transfer, nanotubes are really good at that in 1D direction:)

[@airheart1]

Always great to see the new technologies you see coming in the field! So Tesla’s dojo chips are going to be taking advantage of some of these new processes. Very interesting. I remember seeing the power and cooling being vertically integrated but I did not realize others were designing so much in vertical integration. It all seems obvious when you present it… of course! stick the memory on top and reduce the latency that way! Lol, but I am sure the complications of HOW to do it must be crazy hard to crack. Those different bonding styles and materials being used to allow the chip to chip communication and how to cool it all.. it’s wild 🤪. Nice to see Moore’s law always finds a way forward The 🎄 looks great! Happy Holidays!

[@roshanshaikh2590]

Plz make a video on photonics

[@darmenilyas8132]

Can you please make a video about Silicon Photonics and chips build on photonic technology? Great video as always. Рад видеть что есть видео на такие топики в Ютубе.

[@10produz90]

So interesting:) But arent there issues with Heat dissipation?? I suppose the "lower" layers of the chip would be harder to cool? And btw the trees look great haha

[@roshanshaikh2590]

I have the same doubt

[@matthelfer7394]

I think they will be designed much like dojo where you have heat sinks and or cooling between levels. You can also run a coolant pipe vertically down the center of all chips and place compute chips there and the low temp items around the outside of the SoC.

[@garytulie8567]

May go to silicon carbide semiconductor instead of silicon.

[@alcorza3567]

I remember seeing something fairly recently that was being done as part of a research project where they were putting cooling channels directly into the silicon dies. Think of how the water channels work inside a water block... But just imagine it inside special non-conductice layers inside the silicon itself. This would work really well and can work with multiple layers much like how they connect using TSVs.

[@alcorza3567]

Linus actually talked about it here... kzbin.info/www/bejne/j5W4mHuurbuNmbc - this was the video I mentioned in my previous comment. I'm sure it should be fairly trivial to make this work in 3D early enough. The heat dissipation is massive.

[@mach1553]

Great video, 3D is the only way to overcome Moore's Law which is bottoming out on the 2D level. BTW CC sucks @ 1:32 "leave me know and trust lowest Klaten Astagfirullahaladzim" 🤔

[@ricardoabh3242]

Trademark battle! lol WoW = World Of Warcraft

[@gb-channel1880]

Domino effect . More accurate optics , litography . require extremely clean environements.

[@rgeraldalexander4278]

Thank you so much for taking the time to explain how computing will be handled in the future. What I think...the ultra complicated controls of spacecraft will be needing massive computing in an efficient, small, light weight package. Power consumption is already an issue with electric automobiles, and upcoming autonomous vehicles are going to require a huge amount of computation, so these developments are going to become more and more important in the next few years. Thanks again!

[@WalterKaan]

What an intense industry to be in. And interesting. BTW, your links didn't show up on my youtube. Might me my computer but JIC it helps.

[@h11s20]

Your videos are such a treat. I learn so much from them. Thank you! I would love to see a video about the manufacturing process of modern chips. The machines used and a breakdown of the process and such.

[@AnastasiInTech]

Happy to hear! You may like to check out this one: kzbin.info/www/bejne/fZqVqJ6Hdryth68

[@Alan-er9xi]

Besides heat dissipation question, I'd like to know more about the layers are aligned. I think it's mind blowing that you can align the interconnects when the density of the connection points is so high.

[@icourant]

On a chip with tens of millions of transistors, there are only about 1000 connectors. The connectors a so much bigger than the transistors that it is not a big problem with stacking. The heat is a way bigger problem.

[@onlymediumsteak9005]

TSMC is working on on chip liquid cooling via very small channels

[@icourant]

@@onlymediumsteak9005 That could actually work. but if you cant shrink more the power usage will be about 10-15 watt per layer. so the power will go above 100 watt soon. its not doubled unlimeted.

[@k1lluachan]

@@onlymediumsteak9005 thas exactly how you do it like in engine blocks and heads with cooling channels

[@icourant]

@@erkinalp Yes. But the chemical Insertion reaction can only be applied on a waver with a light source that is not available and never will be because the wavelengths are too small. Wavelengths are much larger than a single atom. They already struggle with the wavelengths now. They use water drops to compress them now bit, but there is no idea yet how to scale that down by some magnitudes needed for your idea. Then there is another insertion method, but that method is way too slow. To insert all the atoms, you require many many years to insert them all for just 1 processor. The process is just too slow and needs, if you calculate it by the same more's law, a few decades at least to develop. Good thought anyway. Thanx for posting.

[@douglswelsher6212]

God, you are so cute, and love your voice! Plus super smart, awesome. I wish I could pick your mind apart about computer hardware and software. But I'm way past in that. You would have loved to get hold of one of my computers that I made for people. It would blow most people away! Peace and love to all

[@MrDox90]

Stacking chips certainly seems a logical step forward, but the most important issue is heat. How will they manage that? Isn't stacking practically gluing two processors on top of one another, and isn't heat dissipation a big issue already? Do they have some new ideas how to transfer heat? Spreading the dye allows for bigger area to dissipate heat to the cooler, how would be an exaggerated example like a cube cpu be cooled? Wouldn't the core, inside melt while the outer layer is barely hot?

[@samlebon9884]

I've heard there is a technique that uses some kind of 'micro chimneys'; a kind of vias between layers.

[@erobusblack4856]

Something similar to graphine crystal chips......

[@NeverTalkToCops1]

City centers have hi rise buildings with single layer homes on the outskirts. Same thing here.

[@caladestine4540]

Great video. Would be interesting to see a video on photonics and its industrial use cases as well as its potential in the consumer market in the coming decade. Cheers

[@roshanshaikh2590]

Plz make a video on the topic of photonics

[@dchdch8290]

+1 for photonics :)

[@PrimeToolbox]

I remember when I was a computer engineering student years ago, people used to talk about the end of Moore's Law. And I asked, why not to stack chips together? Now it's happening!

[@coringavinte5105]

because the energy consumption will increase the more chips you add

[@springwoodcottage4248]

Super interesting! I find it difficult to be certain about the future direction. One theme is clearly these 3d chips, possibly at some point with liquid cooling as used in some of the Cray supercomputers, another theme is neuromorphic chips that circumvent many of the heat extraction troubles, by not having a clock and operate like human brains, another theme is quantum computing. It may be that all these themes and possibly others I don't know of have applications and all have long future developmental time lines. Then there is the limit of atomic size with a silicon atom being approximately 0.2 nm, so that a 2 nm track is now about 10 atoms wide and presumably can not get ever get below one atom. This is the current limit of electron microscopes. All of these things point towards an end of Moore's law in the next few years, or am I missing something? Loved the background Christmas tree. Hope your Tesla car is like new now. Thanks for sharing!

[@ThomasLee123]

Good point. The heat problem always raises its ugly head sooner or later. LOL

[@gerakore8948]

i have envisioned 3d procesors a long time ago. i wonder if they took advantage of component placement to reduce path distance.

[@samlebon9884]

The biggest challenge with 3D stacking is heat dissipation.

[@The_Penguin_City]

Excelent video, nice approach, easy to understand, nice selected topics.

[@DrTeddyMMM]

Thank you so much for all you do! Mwa!

[@hoffenwurdig1356]

One should also recall that in the Terminator film franchise, the prop model of the T-101’s chip was purposely made to look as though composed of a number of cubes -- a prop artistically inspired by thinking about hypercubes. This inevitably gives the impression that data does move up and down within the fictional computer chip, which would qualify the fictional device as a 3D chip similar to those you describe here.

[@Tetlus]

would it be possible to put a type of heat-sink in-between the different layers, while still having the interconnects work?

[@vizender]

There’s a number of connectors on each chiplet they count in the hundreds/thousands what you’ll need to do is to have all of those connectors redirected around the heat sink. Having full sized heat sinks is not really a feasible thing or do. The tech they are looking into are : -some kind of water cooling, even some micro tubes around the entire chip (micro tubes that go between connectors) -Looking into other materials to build the chip. Silicon is not very thermally conductive. But there are some silicon alliage or other weird stuff that are great to make both chips and move heat around. Howether, today it’s mostly not feasable because to complex and/or expensive

[@Tetlus]

@@vizender cool! thanks for the response

[@vernearase3044]

Cooling 'em is gonna be problematic though ... more forward thinking designers will want to integrate cooling channels or heat pipes in the design sandwich.

[@billykotsos4642]

3D STACKING IS COMMMINGGGG

[@rambodini]

It is not TSMC wow. It is AMD wow. We designed the 3D stacking through hybrid bond!

[@Echo3_]

I love your accident, I could listen to you talk tech all day!

[@blackIce504]

Your videos are really good but Samsung , Intel , TSMC are FABS, AMD is a fabless company so they use Samsung or TSMC maybe in future intel as they are going to be making other peoples chips too

[@brandoYT]

China Huawei too.

[@mindright9771]

My question, as pertaining to Intel specifically, will they use 3D stacking technology for their current CISC designs, is it a hybrid of CISC and RISC or will they be moving to RISC exclusively? By the way, this type of technology was actually mentioned in the "Terminator 2" movie. Check it out!

[@perforongo9078]

A hybrid between more powerful cores and less powerful cores. Both types technically CISC x86. x86 instructions already get converted into 4 byte long RISC-like micro-operations.

[@jamegumb7298]

@@perforongo9078 Just stating all CISC instructions get translated into 4byte RISC ones is outright wrong.

[@rogerfrost3793]

3d chips ? Oh ! Skynet chips are like that. 😂 Maybe they have a T-1000 chip somewhere and they are doing reverse engineering.

[@steezegod2768]

Why is TSMC trying to bring Holographic World of Warcraft technology to our lives?

[@softwear9571]

Good work carry on...

[@robertochostakovis]

This kind of stacked monting is not new, In 2015 I worked with a mcu that the Ram chip was solded on top of it OMAP4430.

[@madhumithapremkumar3744]

Intel also should be at par with apple, s m1ultra chip technology. They should not only manufacturing micro chips with old technology whereas they should invest their profit which they have earned till date in manufacturing chips with latest technology. Now artificial intelligence based robots are being created all over the world. Highest memory power is required to activate these robots. Hence processors in these chips with multi core transisters should be produced with neural network. All big chip giants like intel, samsung and ibm etc., should keep this in mind to copeup with future scientific advancement . Scientific advancement has gone to himalayan heights. Advanced technology in manufacturing computer chips is very very essential for ai based machines and robots. Thanks

[@epemsley3787]

Cooling will always be the problem until we can learn to integrate graphene and/or photon technology into the chip designs.

[@epemsley3787]

@@godslayer1415 Why?

[@andytroo]

yes, but stacking decreases the average wirelength, which decreases the energy needs for those chips stacked, compared to the same chips next to each other.

[@dadlord689]

But today's processors are more than enough. It is came to a point where computations are simply not used for human benefits. You don't use any software that can check reactions of chemicals on your body, you just don't have access to it. And so animals are still suffer. Computations are barely used.

[@windward2818]

Miles Bennett Dyson Neural Net CPU. A 3D Terminator chip.

[@chreinisch]

since the machine code is basically only 1 D someone will figure the math of 3D programming

[@max654000]

just a follow up on the background music, the high repetitiveness and swoosh pitch toward the end is actually annoying af. But nonetheless, I learned a great deal in your videos. Thank you! Just would like to concentrate more on ur actual content.

[@visiter127]

Loved the videos, will photonic chips not really be the future,? Surly this is limited aswell

[@blackmennewstyle]

I will never be able to forget that beautiful voice now, hope you are proud of you Anastasi :( Have a great week ahead and keep it up the great job

[@huse8165]

Cooling issue is problem, you just can't put cooler in every layer. Unless you create a 4D cooler.

[@thedankatheist3466]

In the future our processors will just be silver rods towering above the motherboard.

[@metaforest]

The next generation of compute modules are going to have to solve ridiculous thermal management issues.

[@dubsar]

Could you make a video on spintronics? It would be amazing.

[@mtosta2861]

Soon, “user upgradability” will be “fond memory”

[@0animalproductworld558]

The problem in computing is heat. They can stack a bunch of transistors on top of each other but heat is the issue

[@bntagkas]

after seeing how photonic computing can be up to like 40000x times faster and maybe 1000x less energy consumption and more, its hard to care about stuff like these video too much...i wonder if it would have been better to not know

[@roshanshaikh2590]

Plz make a video on photonics

[@AnastasiInTech]

ok :)

[@rksnekyoung353]

Nice 😄

[@GamerTayhong]

I have to be honest. I used to hate her voice and accent. Somehow, it has grown on me. I love it now. I really learned a lot from her too.

[@jeffbankston8806]

Keep Moore's law going ? modern computers are decades past Moore's law

[@markkilley2683]

Quantum computers and optical driven CPUS etc.

[@edpink9724]

Great interesting video! perfect awesome ambient music, whats the track?

[@garywalls5181]

Such a nice way to keep up with the latest tech news with Anastasia and her beautiful voice.

[@vitavacek3483]

Love it, let’s bring it on. Merry Xmas, enjoy winter in Vienna, it is a beautiful city. Wish you all the best from Prague, it is also now nicely Xmas decorated :) P.S. My dream is to download a design of any electronic device from the internet (e.g. mobile phone) and 3D-print it completely including battery, display, case… I would not mind if it’d take a week to print it.

[@matjazwalland903]

very good news regarding the development of new technologies in transistor manufacturing. It would be even better if the chip makers worked with each other. And don’t be hampered by licensed technologists. The whole explanation of the operation is great but I'm worried that the transistors will overheat and break down in the middle part of the chip. so I would like to see a vertical nano graphite tube or something similar to facilitate heat removal.

[@betobeto7903]

"technology limits". Why say that, to me, it just does not make sense. I am sure they said the same when they were building a 144kbs US Robotics modem. LOL. The limit we reached is not in technology but in current knowledge. We ran into a wall that needs to be taken down to move forward! .

[@johnmanderson2060]

I love your knowledge, thanks a lot !

[@elkhankhamzin9346]

silicon on sapphire is it still relevant or not? Question to you as a specialist at new high technology.

[@samlebon9884]

Beauty on Beauty (BoB) is definitely the future of IC designs

[@zhouyangbo4498]

take care of your throat, please stay healthy . gorgeous tech girl.

[@cemery50]

I can forsee computational bio-bots printing 3d nano particle compute units which communicate wirelessly and self power and reproduce...that self orgainize into bio-bot herds...to form robots....and edge computing distributed nodes in a mesh...ohhh my.

[@cemery50]

They've already created computational biotic robots and self replicating dna memory storage...when ai unites all the tools and knowledge....ohhhhh.

[@ThomasLee123]

Wow! Great information and excellent presentation. I wonder how you find time for this stuff. I assume that sleep is not in the cards. :)

[@kwamepalavin8405]

Sounds interesting but, doesn’t‘photonics ‘ preempt all those theories.china’s photonics is very advanced !

[@stantonx9257]

Really? China's photonics has never been advanced, nor has it mass-produced 14nm chips.

[@1bluemoondj]

All that is is the concept art that looks like mini computer city.

[@joeyhensley9199]

Definitely more of a reason to protect Taiwan's sovereignty and independence.

[@brucecunningham6637]

Lets build an Anastasi Asic...... Great videos girl!

[@nielsnb11]

👍

[@a0z9]

O sea ahora casi no hace falta una placa madre pues todos los componentes están en un sólo encapsulado

[@MadRat70]

Graphene will unlock WoW technology

[@larryteslaspacexboringlawr739]

yes please more videos about 3d chips and 3d cooling in the chips

[@NumberSixAtTheVillage]

So they're copying the Atari Jaguar, are they?

[@coolwinder]

This is amazing, background video snippets and info!

[@mathbc1984]

True, the future of chip is in staking them. By the way, really good and nice explanations.

[@Friederich.87]

u have nice hair 👏 video content as well

[@huse8165]

Can they make 4D chip?🤣🤣🤣🤣🤣

[@1bluemoondj]

And the PS 4 concept board image.

[@007us]

do u know heat is the key bottleneck? there is a word call naive

[@rarinkaz]

This is why I own their stock! The Future!!!

[@D3adP00I]

If there ever is a terminator from the future, it's her -.-

[@GBlunted]

This video was awesome! Do you have an accent?

[@mellybrisbane5113]

i didnt understand a damn thing but i liked the video

[@djnavari]

Excellent video. I learn so much from you!!

[@edercarneiro]

Did they say anything about cooling ?

[@ManuelBTC21]

Full wafers layered on top of each other 🤯

[@josephjocson1385]

I can see Multiple Chip Module 3D

[@ralfsobe5529]

Its a good insight whats going on in the tec scene.

[@XuMuKHC]

Big future. Thank you!

[@akeemlouigarde4946]

I like your video Anastasi

[@TatendaZhou]

Isn’t this just like the M1 chip?

[@MrD3m0Nic]

wonder if intel will do an intel and make mindblowing CPU's with this and completely fumble it at the thermal solution they pair with it.

[@Xero_Wolf]

I was thinking the same thing. These 3D chips will definitely need more thought out thermal solution than what we currently have.

[@IbraHasan]

Thank you for this video 💚

[@СергейЗагорулько-в7т]

Please, turn on russian subtitles

[@Khannea]

Please gargle with some salt water, hon.

[@VECTOR-PIXEL-DRAW]

wow smart and bellisima.. me encanta

[@kaustubhrajvaidya6355]

Great Video and great animations. Just a small correction : Intel has already launched product with the 3D stack codenamed "Lakefield" in June 2020. However it is discontinued as of now by Intel. Meteor Lake will be launched in 2023 with next generation of Foveros/3D tech.

[@Waynesification]

3D chips in increasing high performance only really make sense with magnetic or optical technology, otherwise interspacing with cooling. But, if you have up to 40Thz magnetic, or 1 million times faster than normal optical chip, you have enough performance for most things.

[@andrewkamoha4666]

She is amazing !!!

[@hsingkao2024]

Thank you for such wonderful video. But, the background “music” might not be necessary.