Intel Demonstrates First Fully Integrated Optical I/O Chiplet for More Scalable AI

Intel‘s leading optical compute interconnect (OCI) chiplet addresses the emerging need for higher bandwidth, lower power and longer reach, enabling future AI scalability and novel compute architectures. The first 4 Tbps bidirectional OCI chiplet co-packaged with a concept CPU was showcased at OFC2024, demonstrating the maturity of Intel’s in-house, proven Silicon Photonics technology and platform.
Intel Newsroom
Intel Newsroom brings you the latest news and updates on world-changing technology that enriches the lives of everyone on Earth. Catch up on the latest innovations in client computing, artificial intelligence, security, data centers, international news and more. Watch recaps and replays from industry events where Intel has a major role, such as Mobile World Congress (MWC), Intel Innovation, the Consumer Electronics Show (CES) and others.
Connect with Intel Newsroom
Subscribe now to Intel Newsroom on KZbin: / @intelnewsroom
Visit the Intel Newsroom: www.intel.com/...
Follow @IntelNews on Twitter: / intelnews