Packaging Part 1 - Traditional Packaging - Alonso Lopez

References:
[1] Higgins, S. (2018, January 18). TSMC expects 'strong' crypto mining demand to continue. Retrieved from www.coindesk.com/tsmc-expects...
[2] US LIMITS TECH EXPORTS TO CHINESE FIRM ON SECURITY GROUNDS. (2018, November 2). Retrieved from www.scribd.com/article/392251...
[3] Jeff. (2010, October 25). Mosis. Retrieved from mightyohm.com/blog/tag/mosis/
[4] Campbell, M. (2021, January 22). "The majority of our 2023 products will be manufactured internally" - Intel's new CEO is pleased With 7nm's progress. Retrieved from overclock3d.net/news/cpu_main...
[5] Sutton, M. (n.d.). Intel launches new high end gaming processor. Retrieved from www.itp.net/channel/85993/618...
[6] Optical sensors / image sensors. (n.d.). Retrieved from amkor.com/technology/optical-...
[7] Qualcomm Snapdragon 800 Processor first to Use Tsmcs 28HPM advanced process technology. (2013). Microelectronics International, 30(3). doi:10.1108/mi.2013.21830caa.009
[8] Geen, M., Harman, S., & Zhang, J. (2018, December 03). Teledyne E2V completes FIRST Multi-Chip Module assembly on Organic flip-chip. Retrieved from www.microwavejournal.com/arti...
[9] Aril Sigvartsen, J. (2008, April 10). Unix/Linux-server på 5 GHz. Retrieved from www.tek.no/nyheter/nyhet/i/4q...
[10] OSD3358-512M-BSM. (n.d.). Retrieved from www.digikey.com/en/products/d...
[11] W. Chen, P. Rao and W. Tung, "LTCC WiGig Radio Module & USB Dongle," 2019 IEEE International Symposium on Phased Array System & Technology (PAST), Waltham, MA, USA, 2019, pp. 1-3, doi: 10.1109/PAST43306.2019.9021082.
[12] J. Minz, E. Wong, and S. K. Lim, “Thermal and crosstalk-aware physical design for 3D system-on-package,” Proc. - Electron. Components Technol. Conf., vol. 1, no. January 2005, pp. 824-831, 2005, doi: 10.1109/ectc.2005.1441368.

[@goldendragon776]

Thank you very much☺

[@ErossaanBooming]

Intresting video and well presented and enxplained. If you could just correct the video name as it is called Part 2 while in the beginning and based on content it should be part 1

[@user-hg1yd1li2x]

In 1992 Motorola designed and created 1200 pin CBGA's for the PCB's on the Iridium payload.

[@JohnPaulHo]

Take a look at entire series

[@TekCroach]

You should have shown more photos of each type.

[@sbh123yt]

9:37 - I think Intel already used PGA for their 80286 and 80386 processor which came out in the 80s

[@hgb1696]

Are Bga qfp pga is pcb side or substrate side? Because we call fc bga substrate it's kind of substrate not Pcb